Scaling and Miniaturizing Photonic Integration (Panel) - Microelectronics US

Scaling and Miniaturizing Photonic Integration (Panel)

23 Apr 2026

10:15 - 10:55

Silicon photonics for co-packaged optics
Advances in III-V on silicon integration
Miniaturization & its impact on AR/VR, 5G & edge computing
Manufacturing & packaging challenges

Chairperson

Royston Sequeira, SOC Program Manager, GPU Technologies & Engineering - AMD

Speakers

Eviana Alice Breuss, Founder and CEO - TENGENA LLC

Paul Davids, Distinguished Member of Technical Staff - Sandia National Labs

Tuqeer Nasir, Business Development Director - General Graphene Corporation